Wafer Chucks Electrostatic Chucks (ESC) Manufacturer

High-Performance Wafer Chucks | Vacuum & Electrostatic Chucks (ESC) Manufacturer

The Critical Foundation for Wafer Processing & Metrology

In the high-stakes world of semiconductor manufacturing, even microns matter. As a specialized wafer chuck manufacturer, we engineer precision vacuum chucks, advanced electrostatic chucks (ESC), and durable metal chucks to support the most demanding processes—from ultra-thin wafer handling to high-temperature etching and high-force applications.

Whether you are running a high-volume fab or a university research lab, our chucks provide the flatness, cleanliness, and durability required for zero-defect manufacturing.

Product Series 1: Vacuum Wafer Chucks

Ideal for Probing, Dicing, and Thin Wafer Handling.

Our Vacuum Wafer Chucks utilize porous ceramic or multi-zone groove technology to provide a secure, warp-free grip on the backside of the wafer. Unlike standard chucks, our design minimizes bullseye marks and edge exclusion issues.

Material Options: High-purity Alumina (Al2O3), Silicon Carbide (SiC), or Porous Ceramic

Flatness: Superior parallelism down to < 5µm

Custom Sizes: From 2" (50mm) to 12" (300mm) and irregular dies (singulation)

Applications: Probe stations, wafer grinders, laser dicing, and pick-and-place systems

Special Feature: Multi-zone vacuum control to support ultra-thin (flexible) wafers without cracking

Product Series 2: Electrostatic Chucks (ESC)

Plasma & High-Temperature Stability.

For processes where physical contact via vacuum holes is not an option, our Electrostatic Chucks (ESC) are the solution. Using Coulombic or Johnsen-Rahbek (JR) principles, we provide a uniform clamping force across the entire wafer surface.

Technology: Coulombic Type (Alumina) & JR Type (Aluminum Nitride - AlN)

Thermal Control: Embedded heater pedestals and cooling channels for precise temperature management (-20°C to +200°C+)

Durability: Plasma-sprayed ceramic coatings to resist erosion in Etch and CVD environments

Customization: Single or bi-polar electrodes, embossed/grooved surfaces to purge backside gas (Helium) for thermal conduction

Refurbishment: We offer ESC refurbishment services to restore clamping force and extend lifespan at 40% cost of new

Product Series 3: Metal Wafer Chucks 

Ideal for High-Force Probing, Thermal Cycling, and Cost-Effective Production.

Our Metal Wafer Chucks are precision-machined from stainless steel, aluminum alloy, or tool steel for applications requiring high mechanical strength, fast thermal response, or budget-friendly solutions. These chucks are widely used in R&D, manual probe stations, and high-throughput industrial environments where ceramic chucks are not mandatory.

Material Options: Stainless Steel (304, 316), Aluminum Alloy (6061, 7075), Tool Steel

Flatness: < 10µm to < 25µm depending on material and size

Custom Sizes: From 1" (25mm) to 12" (300mm) and custom shapes for MEMS or optoelectronics

Surface Finish: Precision ground, mirror polished, or with vacuum groove patterns

Vacuum Grooves: Concentric rings, spiral patterns, or custom multi-zone designs

Applications: Manual probe stations, high-force wafer probing, thermal chuck systems (-40°C to +150°C), pick-and-place equipment, and optical inspection

Key Advantages:

• Excellent thermal conductivity for fast heating and cooling

• High mechanical strength for heavy-duty probing without deformation

• Lower cost compared to ceramic chucks

• Easy to machine for rapid prototyping and custom geometries

• Optional hard coating (Ni or DLC) for wear resistance and corrosion protection

Technical Specifications

Why Choose Us

Don't settle for off-the-shelf solutions. We are a direct manufacturer, not a middleman. This means lower costs, faster prototyping, and full customization.

In-House Ceramic & Metal Machining – We grind, polish, and mill both hard ceramics and precision metals in-house, ensuring absolute control over surface roughness, flatness, and profile.

Cleanroom Assembly – Assembled in Class 1000 (ISO 6) cleanrooms to prevent particle contamination.

100% Tested – Every chuck is tested for clamping force, leak rate, dielectric strength (for ESC), and high voltage breakdown (for ESC).

Local Support & Speed – As your local manufacturer, we offer 24-hour quotes and rapid turnaround for custom R&D chucks, including metal prototypes.

Applications

Our wafer chucks are mission-critical in the following sectors:

• Semiconductor Front-End – Plasma Etching, CVD/PVD deposition, Lithography (Stepper)

• Back-End & Assembly – Wafer probing (ATE), dicing, grinding, and backside metallization

• Advanced Packaging – TSV (Through Silicon Via) and wafer bonding

• R&D & Metrology – Probe stations, optical inspection systems, and digital holography (DHM)

• High-Force & Thermal Testing – Metal chucks for thermal cycling and heavy-duty probing

Ready to upgrade your wafer handling?

Let us know your requirements. Whether you need a 300mm Electrostatic Chuck for an AMAT / TEL tool, a custom Vacuum Chuck for a non-standard substrate, or a rapid-turnaround Metal Chuck for your probe station, we have the solution.

We are committed to being your long-term partner in the semiconductor supply chain. Let's discuss your OEM specs today.

GET QUOTE

• Visit our website: https://www.nbyichou.com/
• Email us: [email protected]
• Call us/whatsapp: +86 13355741031
• Chat with us: Live chat support available on our website